QTREX Develops Cryogenic Chip Carrier for Quantum Computing Applications

QTREX Quantum Ltd. has successfully produced a cryogenic chip carrier using its proprietary single-build Additively Manufactured Electronics (AME) process. This development, based on a design from a major U.S. technology firm, marks a significant expansion for the company into the processor-interface layer of the quantum hardware stack. By integrating signal transport and carrier functions into a monolithic architecture, the technology addresses critical scaling challenges related to signal density and thermal management in cryogenic environments.

QTREX Quantum Ltd. (Nasdaq: QTEX) announced the successful production of a cryogenic chip carrier utilizing its proprietary single-build Additively Manufactured Electronics (AME) process. The project was executed using a design provided by a leading U.S.-based technology company currently developing full-stack quantum computing systems. This milestone signifies QTREX’s strategic move into the processor-interface layer, allowing the company to manage both signal transport and carrier-level functions within a single AME architecture. By consolidating these capabilities, the company aims to create a new category of quantum components that can be integrated into various future system architectures.

The cryogenic chip carrier is a vital component that supports the quantum processor and manages signal fan-out between the processor interface and the cryogenic input/output (I/O) stack. QTREX’s solution utilizes a Kapton-class polyimide architecture specifically adapted for the extreme low-temperature environments required for quantum operations. The single-build AME process enables the creation of a monolithic structure that includes conductive pathways, dielectric structures, and shielding features. This approach eliminates the need for multiple manual assembly steps and separate connectors, which QTREX claims will reduce potential failure points and significantly increase routing density for high-channel-count processors.

CEO Dagi Ben-Noon highlighted that the achievement follows engagement with multiple industry players and positions QTREX to address fundamental scaling challenges in the quantum sector. As quantum systems scale, the need for denser routing and lower thermal loads becomes more acute, and the ability to engineer shielding directly into the carrier offers a path that conventional connector-based architectures may not support. Looking ahead, QTREX plans to focus on customer-specific designs tailored to individual processor architectures and system requirements. The company will showcase the new chip carrier sample during private meetings at Quantum.Tech World 2026 in Boston on June 25–26.