Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

Reuters· June 20, 2026

Intel has appointed industry veteran Seok-Hee Lee to lead its foundry packaging operations as the company expands its semiconductor manufacturing services. This strategic hire underscores the growing importance of advanced packaging technologies in the modern chip-making landscape. By bringing in experienced leadership, Intel aims to strengthen its competitive position against other major foundries in the high-performance computing and AI sectors.

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